Ultimate Repaste KIT K5 PRO 10g & KRYO33 3g Thermal Paste and Thermal Sealant Replacement Kit Compatible with Apple iMac, Asus ROG, Acer Nitro, MSI laptops, RTX 3080, PS4, Nintendo Switch, XBOX
Price:7695.75
MRP:12313.2
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- K5-PRO is a high quality gummy / sticky thermal paste designed for use on memory chips and other components where thermal pads are originally used.
- K5-PRO can replace the soft thermal pads used on computers (best performance up to 1mm, maximum space can be filled up to 3mm).
- K5-PRO has a thermal conductivity K>5.3W/m.K* (at least 3 times higher than common thermal buffers used on computers and commercial electronics).
- K5-PRO is very easily applied directly to the component and has no electrical conductivity. Operating temperature -90 to 250 degrees Celsius.
- KRYO33 has a thermal conductivity > 13W/mK*. Thermal resistance < 0.004 K/W. Maximum possible thermal conductivity (for non-electrically conductive pastes).
- KRYO33 is ideal for over clocking as it is superior to all thermal pastes originally used by manufacturers. No curing time (the system can be used immediately after application). Long service life (at least 8 years after application).
- KRYO33 can be perfectly combined with K5 PRO because both consist of very small particles. This allows the heatsink to reach the minimum possible distance from the hot component, even if the heatsink is not flat in all places. At the same time, all gaps between the heatsink and the component, even the invisible gaps on the metal surface, are filled with heat-conducting materials.
- KRYO33 has zero electrical conductivity. It can be applied to all surfaces of electronic components and circuit boards, even aluminum. Colour Grey Density 2.9 (30% less than competitive products, so less weight needed for the same surface). Certification Reach, ROHS, CE Electrical conductivity 0 pS/m Viscosity 120-170 Pitch. Operating temperature -130°F to +518°F Designed and produced in the EU. (GREECE).
- K5-PRO is a high quality gummy / sticky thermal paste designed for use on memory chips and other components where thermal pads are originally used.
- K5-PRO can replace the soft thermal pads used on computers (best performance up to 1mm, maximum space can be filled up to 3mm).
- K5-PRO has a thermal conductivity K>5.3W/m.K* (at least 3 times higher than common thermal buffers used on computers and commercial electronics).
- K5-PRO is very easily applied directly to the component and has no electrical conductivity. Operating temperature -90 to 250 degrees Celsius.
- KRYO33 has a thermal conductivity > 13W/mK*. Thermal resistance < 0.004 K/W. Maximum possible thermal conductivity (for non-electrically conductive pastes).
- KRYO33 is ideal for over clocking as it is superior to all thermal pastes originally used by manufacturers. No curing time (the system can be used immediately after application). Long service life (at least 8 years after application).
- KRYO33 can be perfectly combined with K5 PRO because both consist of very small particles. This allows the heatsink to reach the minimum possible distance from the hot component, even if the heatsink is not flat in all places. At the same time, all gaps between the heatsink and the component, even the invisible gaps on the metal surface, are filled with heat-conducting materials.
- KRYO33 has zero electrical conductivity. It can be applied to all surfaces of electronic components and circuit boards, even aluminum. Colour Grey Density 2.9 (30% less than competitive products, so less weight needed for the same surface). Certification Reach, ROHS, CE Electrical conductivity 0 pS/m Viscosity 120-170 Pitch. Operating temperature -130°F to +518°F Designed and produced in the EU. (GREECE).